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3D Time-of-flight Image Sensors Market: Trends and Competitive Landscape Outlook 2025

The Latest Research Report “3D Time-of-flight Image Sensors Market: Trends and Competitive Landscape Outlook 2025” provides information on pricing, market analysis, shares, forecast, and company profiles for key industry participants. - MarketResearchReports.biz

​This report presents the worldwide 3D Time-of-flight Image Sensors market size (value, production and consumption), splits the breakdown (data status 2013-2018 and forecast to 2025), by manufacturers, region, type and application.

This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter’s Five Forces Analysis.

3D time-of-flight (ToF) sensor is part of the 3D ToF image sensor family. The device combines ToF sensing with an optimally-designed analog-to-digital converter (ADC) and a versatile, programmable timing generator (TG).

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The built-in TG controls the reset, modulation, readout, and digitization sequence. The programmability of the TG offers flexibility to optimize for various depth-sensing performance.

On the basis of type, the 3D Time-of-flight Image Sensor market is segmented into Half-QQVGA ToF Image Sensor, QVGA ToF Image Sensor, and Others. The QVGA ToF Image Sensor segment is expected to account for the larger share of the global market in 2017.

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End-users, included in this market are Consumer Electronics, Robotics and Drone, Machine Vision and Industrial Automation, Entertainment, Automobile, and Others usage. The Consumer Electronics application is expected to account for the largest share of the global market in 2017.

Based on regions, the global 3D Time-of-flight Image Sensor market is segmented into North America, Europe, China, Japan, Korea, Asia Other, and the Rest of the World (ROW). USA and Europe is expected to account for larger share and China is growing fastest of the market during the forecast period.

The 3D Time-of-flight Image Sensors market was valued at 620 Million US$ in 2017 and is projected to reach 2670 Million US$ by 2025, at a CAGR of 20.0% during the forecast period. In this study, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for 3D Time-of-flight Image Sensors.

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The following manufacturers are covered in this report:
Texas Instruments
STMicroelectronics
PMD Technologies
Infineon
PrimeSense (Apple)
MESA (Heptagon)
Melexis
ifm Electronic
Canesta (Microsoft)
Espros Photonics
TriDiCam

3D Time-of-flight Image Sensors Breakdown Data by Type
Half-QQVGA ToF Image Sensor
QVGA ToF Image Sensor
Others
3D Time-of-flight Image Sensors Breakdown Data by Application
Consumer Electronics
Robotics and Drone
Machine Vision and Industrial Automation
Entertainment
Automobile
Others

3D Time-of-flight Image Sensors Production by Region
United States
Europe
China
Japan
South Korea
Other Regions

3D Time-of-flight Image Sensors Consumption by Region
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Malaysia
Philippines
Thailand
Vietnam
Europe
Germany
France
UK
Italy
Russia
Rest of Europe
Central & South America
Brazil
Rest of South America
Middle East & Africa
GCC Countries
Turkey
Egypt
South Africa
Rest of Middle East & Africa

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